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3D electronics is an emerging approach that enables electronics to be integrated within or onto the surface of objects. While it has long be used for adding antennas and simple conductive interconnects to the surface of 3D injection-molded plastic objects, more complex circuits are increasingly being added onto surfaces made from a variety of material by utilizing new techniques. Furthermore, in-mold electronics and 3D printed electronics enable complete circuits to be integrated within an object, offering multiple benefits that include simplified manufacturing and novel form factors. With 3D electronics, adding electronic functionality no longer requires incorporating a rigid, planar PCB into an object then wiring up the relevant switches, sensors, power sources and other external components.
This report from IDTechEx provides an extensive overview of all approaches to 3D electronics, informed by interviews with major players in each field. The pros and cons of each approach are weighed against each other for different applications, with numerous case studies showing how the different manufacturing techniques are deployed across the automotive, consumer goods and medical device sectors. Furthermore, through detailed analysis of the technologies and their requirements we identify innovation opportunities for both materials and manufacturing methods. All the approaches and technologies analyzed in this report are shown below on a roadmap that shows their progress from concept to commercialization for different applications.
Figure 1: The status of different 3D electronics technologies for different applications, from concept to commercialization. For more details please see the IDTechEx Report 3D Electronics 2020-2030.