Wafer-level
packaging (WLP) is the technology of packaging an integrated circuit while
still part of the wafer, in contrast to the more conventional method of
slicing the wafer into individual circuits (dice) and then packaging them.
Wafer-Level Packaging includes Fan-in WLP and Fan-out WLP on the base of
classification.
Electronics, IT & Telecommunication, Industrial, Automotive and
Aerospace & Defense are the main application of Wafer-Level Packaging
product and Asia is the largest Wafer-Level Packaging market on
production.
Global Wafer-Level Packaging market is projected to reach $ 5.3 Billion by
2020, with a GAGR of 21.5% from 2016, and Asia will have a big dynamic
momentum on the market growth. The major players in the global Wafer-Level
Packaging market are Xintec, Fujitsu Ltd., China Wafer Level CSP Co., Ltd.,
Amkor Technology, Deca Technologies, ASML Holding etc.
Wafer Level Packaging Report by Material, and Geography – Global Forecast
to 2025 is a professional and comprehensive research report on the world’s
major regional market conditions, focusing on the main regions (North
America, Europe and Asia-Pacific) and the main countries (United States,
Germany, United Kingdom, Japan, South Korea and China).
The report firstly introduced the Wafer Level Packaging basics:
definitions, classifications, applications and market overview; product
specifications; manufacturing processes; cost structures, raw materials and
so on. Then it analyzed the world’s main region market conditions, including
the product price, profit, capacity, production, supply, demand and market
growth rate and forecast etc. In the end, the report introduced new project
SWOT analysis, investment feasibility analysis, and investment return
analysis. |
Global WafUS$ 3,200