< Key Hightlight >

In the context of China-US trade war and COVID-19 epidemic, it will have a big influence on this market. 3D IC and 2.5D IC Packaging Report by Material, Application, and Geography – Global Forecast to 2025 is a professional and comprehensive research report on the world’s major regional market conditions, focusing on the main regions (North America, Europe and Asia-Pacific) and the main countries (United States, Germany, United Kingdom, Japan, South Korea and China).

In this report, the global 3D IC and 2.5D IC Packaging market is valued at USD XX million in 2022 and is projected to reach USD XX million by the end of 2026, growing at a CAGR of XX% during the period 2022 to 2026.

The report firstly introduced the 3D IC and 2.5D IC Packaging basics: definitions, classifications, applications and market overview; product specifications; manufacturing processes; cost structures, raw materials and so on. Then it analyzed the world’s main region market conditions, including the product price, profit, capacity, production, supply, demand and market growth rate and forecast etc. In the end, the report introduced new project SWOT analysis, investment feasibility analysis, and investment return analysis. 

The major players profiled in this report include:

Taiwan Semiconductor Manufacturing Company Limited (Taiwan)

Samsung Electronics Co., Ltd. (South Korea)

Toshiba Corp. (Japan)

Pure Storage Inc. (U.S.)

ASE Group (Taiwan)

Amkor Technology (U.S.)

United Microelectronics Corp. (Taiwan)

STMicroelectronics NV (Switzerland)

Broadcom Ltd. (Singapore)

Intel Corporation. (U.S.)

Jiangsu Changing Electronics Technology Co., Ltd. (China)

……

The end users/applications and product categories analysis:

On the basis of product, this report displays the sales volume, revenue (Million USD), product price, market share and growth rate of each type, primarily split into-

3D Wafer-Level Chip-Scale Packaging

3D TSV

2.5D

……

On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate of 3D IC and 2.5D IC Packaging for each application, including-

Logic

Imaging & Optoelectronics

Memory

MEMS/Sensors

LED

Power

……