Abstract

Amid escalating geopolitical risks, ongoing conflicts, and tightening monetary policies in Europe and the U.S., global economic performance is expected to remain flat compared to 2023. However, the semiconductor market is nearing the end of its inventory adjustments, with demand in the automotive, high-performance computing (HPC), and Artificial Intelligence of Things (AIoT) sectors poised to support a return to growth, potentially leading to double-digit gains. Additionally, wide-bandgap compound semiconductors, or third-generation materials, are gaining attention for their high voltage resistance, temperature tolerance, and energy efficiency—crucial attributes for achieving net-zero emissions. Companies in Europe, the U.S., and Japan currently lead in this market, with emerging competition from China, South Korea, and Taiwan. This value pack provides an overview of global semiconductor market performance, analyzes the competitive landscape of leading DRAM suppliers—Samsung, SK Hynix, and Micron—and explores future developments in 3D NAND, major wafer foundries, and the third-generation semiconductor industry across key regions. It also examines policies of major countries for third-generation semiconductors, such as Japan, South Korea, and China.